显影机设备/Developer
has completed independent research and development of wet process development equipment for CF, Array, TP and other sizes from G2.5 to G8.6 and above
Applicable process：CF、Array、TP等
Applicable substrate size：All Size
Applicable substrate thickness：≥0.3mm
Development type：Multi-angle Oscilation Type Shower / Dip
Equipment type：I Type，U Type，Line Type，Custom Made
Process indicators：
1.High Uniformity Ultra-low Pressure Spray；
2.Excellent Process Reliability，High CD Uniformity；
3.Defoaming Management；
4.No Mist, No Roller Mark, No Contamination And No Scratch；
5.Low Running Cost。
