Kzone has successively completed independent research and development of various types of cleaning machine equipment for sizes from G2.5 to G8.6 and above, including INC/UPC, DKC, DIC, BPC, ODF, etc
Applicable process:INC/UPC,DKC,DIC,BPC,ODF...
Applicable substrate size:All Size
Applicable substrate thickness:≥0.3mm
Cleaning method:UV/AP,DB/RB Brush,HP,BJ/SJ,HPMJ,MS,IR……
Equipment type:I Type,U Type,Line Type,Custom Made
Process indicators:Contact Angle
Particle Removal Rate
ESD Control
No Mura, No Roller Mark,No Contamination And No Scratch
Low Running Cost